| 摘要 |
A handler system for cutting a semiconductor strip into semiconductor package devices has on-loader unit (10) for loading semiconductor strips deposited on a cassette, drawer unit (20) for holding the strips from the on-loader unit (10) at drawer picker (21, Fig. 3a) and strip transferring unit (30) for transferring the strip to cutting device (D), where the strip is cut into individual package devices. The package devices are then transferred to a package cleaning unit (40) for cleaning using a brush and an air nozzle, to a package drying unit (48), and then to a package deposit unit (60) for moving the dried package devices. The package devices are then moved by package pick-up unit (70) mounted on one side of the package deposit unit (60) to a virtual inspection means (90) for a quality inspection. A package tray deposit unit (50) contains trays for holding the inspected devices classified by their quality.
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