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发明名称
METHODS AND APPARATUS FOR TREATING SEED LAYER IN COPPER INTERCONNECTIONS
摘要
申请公布号
EP1216486(A1)
申请公布日期
2002.06.26
申请号
EP20000965487
申请日期
2000.09.27
申请人
LAM RESEARCH CORPORATION
发明人
HYMES, DIANE, J.
分类号
C25D5/34;C23C18/16;C25D7/12;C25D17/00;H01L21/00;H01L21/02;H01L21/288;H01L21/3205;H01L21/768;(IPC1-7):H01L21/768;C23C18/18
主分类号
C25D5/34
代理机构
代理人
主权项
地址
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