HIGHLY THERMALLY CONDUCTIVE EPOXY RESIN COMPOSITION, SHEETLIKE MATERIAL COMPRISING THE SAME COMPOSITION AND HIGHLY THERMALLY CONDUCTIVE SUBSTRATE COMPRISING THE SAME SHEETLIKE MATERIAL

摘要

PROBLEM TO BE SOLVED: To obtain a highly thermally conductive epoxy resin composition, a sheetlike material formed from the composition and a highly thermally conductive substrate used for a power module, etc., produced from the sheetlike material. SOLUTION: This composition is obtained by adding a highly thermally conductive filler for imparting high thermal conductivity to a one-part epoxy resin composition comprising a liquid epoxy resin and a latent curing agent and further adding a sheet-forming agent for converting the epoxy resin composition into a tackfree sheetlike material.