| 摘要 |
PROBLEM TO BE SOLVED: To obtain a epoxy resin composition for sealing semiconductor having excellent moldability, moistureproof reliability, crack resistance on soldering, preservation at high temperatures and flame-retardancy, without using conventional flame-retardant such as halogen-based flame-retardant, antimony compound, aluminum hydroxide and magnesium hydroxide. SOLUTION: This epoxy resin composition for sealing semiconductor comprises as indispensable components an epoxy resin expressed by general formula (1) (where R is a group selected from a hydrogen atom and a C1-9 alkyl group same as or different from each other; and n is 1 to 5 positive number as an average), a phenolic resin expressed by general formula (2) (where notation is same as (1)), and a compound expressed by general formula: MgaAlb(OH)c(CO3)d and/or general formula: MgxAlyOz (where a, b, c, d, x, y, and z each denotes a positive number of 0.1 or more).
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