| 摘要 |
PROBLEM TO BE SOLVED: To obtain a surface position detecting method and a projection aligner using the same that detects surface position information in an optical axis direction of a wafer surface to position a pattern area of the wafer in an allowable depth of focus of a projection lens and can manufacture a semiconductor device with high density. SOLUTION: When a pattern on a first material is projected to a pattern area on a second material through a projection optical system and a surface shape of the pattern area is measured by position information of a plurality of measuring points in the pattern area on the second material, measurement values of the surface shape are separated into an error component produced by a topographic change in the pattern area and an error component produced by measurement error quantity of an optical factor, and the measurement error quantity of the optical factor is calculated as a compensational value at a plurality of the measuring points, and the surface position of the pattern area is determined by adjusting measurement values at a plurality of the measuring points using the compensational values.
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