发明名称 |
Method and apparatus for reducing contamination in a wafer loadlock of a semiconductor wafer processing system |
摘要 |
A method and apparatus for heating a loadlock to inhibit the formation of contaminants within the loadlock. At least one heater is attached to the walls of the loadlock to boil contaminants from the surfaces within the loadlock. These desorbed contaminants are exhausted from the loadlock by a vacuum pump. Alternatively, a purge gas can be supplied to the loadlock while the loadlock is being heated. The flow of purge gas flushes the desorbed contaminants from the loadlock.
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申请公布号 |
US6410889(B2) |
申请公布日期 |
2002.06.25 |
申请号 |
US20010961152 |
申请日期 |
2001.09.21 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
DAVIS MATTHEW F.;MCALLISTER DOUGLAS R.;EVANS DAVID |
分类号 |
H01L21/324;C23C14/56;C23C16/44;H01L21/00;H01L21/02;(IPC1-7):F27D11/00 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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