发明名称 |
Dual-hardness polishing pad for linear polisher and method for fabrication |
摘要 |
A composite, dual-hardness polishing pad for use in a linear chemical mechanical polishing apparatus and a method for forming the pad are described. In the composite, dual-hardness polishing pad, a pad body is first provided which has a leading edge and a trailing edge for mounting to a linear belt immediately adjacent to a second polishing pad. The pad body is fabricated of a material that has a first hardness, the leading edge contacts an object being polished on the composite polishing pad before the trailing edge when the linear belt turns in a linear polishing process. The composite polishing pad further includes a buffer pad that is adhesively joined to the leading edge of the pad body for contacting the object that is being polished, the buffer pad may be fabricated of a material that has a second hardness which is at least 20% smaller than the first hardness such that impact on the object being polished is minimized during a linear polishing process. The present invention is further directed to a method for adhesively joining a buffer pad to a pad body of a polishing pad.
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申请公布号 |
US6409587(B1) |
申请公布日期 |
2002.06.25 |
申请号 |
US20000713827 |
申请日期 |
2000.11.15 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD |
发明人 |
SHIH TSU;JANG SYUN-MING;CHEN YING-HO;CHIOU WEN-CHIH |
分类号 |
H04N7/30;B24B21/04;B24D11/08;G06F17/14;G06T9/00;H03M7/30;H04N1/41;(IPC1-7):B24D11/00 |
主分类号 |
H04N7/30 |
代理机构 |
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