发明名称 |
Power inverter with heat dissipating assembly |
摘要 |
The invention is a power inverter having a heat dissipating assembly. A heat sink plate is supported on the printed circuit board in a spaced configuration so that a space exists between the heat sink plate and the outer housing. The printed circuit board assembly includes mosfets inserted into the printed circuit board and electrically connected thereto. The heat sink plate abuts against a first side of the mosfets at an upper end of the mosfets to directly absorb heat from the mosfets. The exterior surface of the housing is provided with a plurality of heat dissipating fins to further enable heat dissipation.
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申请公布号 |
US6411514(B1) |
申请公布日期 |
2002.06.25 |
申请号 |
US20010800492 |
申请日期 |
2001.03.08 |
申请人 |
RALLY MANUFACTURING, INC. |
发明人 |
HUSSAINI SAIED |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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