BOARD FOR MOUNTING OPTICAL PART, PACKAGE SUBSTRATE AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a substrate for mounting optical parts and a printed circuit board which enable the high density mounting of electrical parts or optical parts to an optical waveguide and with which the optical axis alignment of an optical waveguide with the optical parts can easily be realized. SOLUTION: A board 10 for mounting the optical parts has a least an optical part mounting part on one surface of a glass substrate 1, an optical wiring layer 9 composed of a core and a cladding material on the other surface, and is provided with a via hole 2 which conducts with the optical part mounting part and passes through the glass substrate. Furthermore, a package board can be prepared by mounting an optical part 14 and an electrical part 15, and a printed circuit board 20 can be prepared by connecting the package substrates through an electrically conductive bump.