| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device that can efficiently disperse heat generated in the active layer of a light-emitting device to the outside. SOLUTION: An insulating layer 8 is formed on the surface of a substrate 2, and a through hole 8b is formed in the insulating layer 8. Then, an electrode 10 for arranging the light-emitting device is formed on the through hole 8b, and the electrode 10 for arranging the light-emitting diode is directly brought into contact with the substrate 2. Or, the electrode 10 for arranging the light- emitting device is formed so that at least one portion comes into contact with the semiconductor substrate 2, and the light-emitting device 18 is packaged onto the electrode 10 for arranging the light-emitting device. The height of the active layer of the light-emitting diode can be set to 120μm or less from the surface of the substrate or that of the semiconductor substrate. On the substrate 2, a photodiode used as a light detection section can be provided.
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