| 摘要 |
PURPOSE: A wafer cleaning apparatus is provided to improve an electrical characteristic by equally cleaning an oxide. CONSTITUTION: A wafer cleaning apparatus comprises a cassette(11) loaded with wafers(12), a robot arm for holding and moving the wafers(12) in the cassette(11), an aligner for aligning the flat zones(12a) of the wafers(12) in the cassette(11), a lower supporting plate(13) located beneath the cassette(11) for supporting the cassette(11), a rotating shaft(15) connected with the lower supporting plate(13) for circulating the loaded wafers(12), a rotating motor(14) for driving the rotating shaft(15). At this time, an oxide is equally cleansed due to the rotating motor(14), thereby improving the characteristic and the structure of the oxide.
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