发明名称 |
HEAT-SINK USING CARBON NANO-TUBE |
摘要 |
PURPOSE: A heat-sink using carbon nano-tube is provided to efficiently radiate heat generated from a laser diode and to prevent a damage or a surface separation of the laser diode due to the difference of thermal expansivity by using a carbon nano-tube having a good thermal conductivity. CONSTITUTION: A heat-sink comprises a submount heat-sink fixed with a laser diode, carbon nano-tubes formed on the submount heat-sink, a stem for radiating a heat to the outer connected to the submount heat-sink using a solder having a bad electrical conductivity and having a good thermal conductivity for electrically insulating the contact portion. The submount heat-sink further includes mixed body with a bucky paper using the carbon nano-tubes and an insulating body.
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申请公布号 |
KR20020046338(A) |
申请公布日期 |
2002.06.21 |
申请号 |
KR20000075665 |
申请日期 |
2000.12.12 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
LEE, JAE EUN;SHIN, JIN GUK |
分类号 |
H01S5/022;(IPC1-7):H01S5/022 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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