| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of producing a ceramic member for a semiconductor treatment device, by which warps of a ceramic heater and an electrostatic chuck can be suppressed and the dimensions and the arrangement of a heating element wiring or/and an inner electrode can be formed in high accuracy. SOLUTION: The method of producing the ceramic member for the semiconductor treatment device comprises a process for forming grooves, in which the heating element wiring or/and the inner electrode are arranged, on a substrate of a ceramic sintered compact, a process for forming the heating element wiring or/and the inner electrode by charging an electroconductive paste being a precursor of the heating element wiring or/and the inner electrode into the grooves and firing, a process for superposing another substrate of the ceramic sintered compact onto the substrate of the ceramic sintered compact mentioned above, a process for connecting the heating element wiring or/and the inner electrode to electrode terminals, and a process for subjecting the superposed substrates of the ceramic sintered compacts to heat treatment to joint them to each other.</p> |
