| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor chip for forming an image of enhanced quality by filtering out the infrared component from image information. SOLUTION: This method comprises providing a semiconductor wafer having a main surface defining chip areas defining bonding pads and three linear arrays of photosites, depositing a clear layer on the semiconductor wafer, depositing a first primary color filter layer on a first linear array of the photosites, depositing a second primary color filter on a second linear array of the photosites, depositing a third primary color filter layer on alternate photosites of a third linear array of the photosites, and depositing an infrared filter layer on the photosite in the third linear array, which have no color filter layer.
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