| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of cleaning substrate by which contaminants, particularly, fine particles, atoms, ions, etc., of copper, copper alloys, etc., adhering to a substrate, such as a silicon substrate, etc., can be removed sufficiently, and to provide a cleaning liquid. SOLUTION: In the method, the substrate is cleaned with a cleaning liquid containing sulfuric acid, hydrogen peroxide, hydrofluoric acid, and/or nitric acid. It is more preferable to adjust the proportion of the sulfuric acid in the cleaning liquid to 5-20 vol.% and the proportion of the hydrogen peroxide in the cleaning liquid to 20-50 vol.% (when the concentration of the hydrogen peroxide is 33 vol.%). It is also more preferable to adjust the proportion of the total amount of the hydrofluoric acid and nitric acid in the cleaning solution to 0.5-5 vol.%.
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