PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board incorporating a capacitor with a thin electrode and a manufacturing method therefor. SOLUTION: The manufacturing method of the printed wiring board has a capacitor where a dielectric layer is sandwiched by electrode layers. The method has a layer forming process for forming composite copper plating layers 2, 4 and 6 in which at least one electrode layer is constituted of an electroless plating layer whose thickness is not more than 15μm or the electroless plating layer and an electrolytic plated layer which is brought into contact with the layer and whose thickness is not more than 15μm.