| 摘要 |
The present invention relates to the ultra/thin type condenser micriphone assembly and method for assembling the same. The presentinvention unifies the microphone assembling process into a process of accumulating independent and individual components such as adiaphragm assembly, a spacer ring, the second base ring, a dielectric plate, the first base ring a PCB and so forth. According toa preferred implementation of the present invention, dielectric plates and base rings are not subject to any deformation or other damage caused by press fitting process. Furthermore, the final ultra-thin type condenser microphone may be manufactured with a high productivity and may have significantly improved quality. Thepresent invention naturally integrates dielectric plates and baserings, as independent and individual components, with other structures without any press fitting assembly process. As a result, the high quality of the final ultra-thin type microphone assembly may be maintained. |
