APPARATUS AND METHOD FOR PACKAGING AN ELECTRONIC IMAGER ALLOWING USE OF MAXIMUM ACTIVE SURFACE

摘要

An integrated circuit package housing an electronic imager die (38) for use in a conventional SLR camera is disclosed. The package includes a substrate (46) with conductive circuitry and an electronic imager die (38) with a surface area approximately the size of a camera focal image plane mounted thereon. A frame (50) with an inwardly depending lip (82) and an integral channel (86) is bonded to the substrate (46) and is provided with a transparent window (54), the window (54) and the frame (50) residing at the focal image plane. The window (54) and frame (50) protect the active die surface from contamination. The substrate (46) contains additional area for supporting electronics circuitry, all of which reside at the film rails and along the film path. The electronic film package allows the use of an imager die area of up to the size of the camera's focal image plane.