PROCESS FOR SECURING A MICROWAVE MODULE TO A SUPPORT

摘要

The present invention relates to a process for securing to a metal support at least one microwave electronic module made on a substrate one of whose faces forms an earth plane. The process consists in depositing between the face forming the earth plane and the metal support, at least one strip of conducting adhesive (12',14',19',20') at the level of the zones of breakage of the earth plane. The invention applies to the microwave field.