发明名称 INTERCONNECTING FLEXIBLE PRINTED BOARDS
摘要 The invention relates to a method for interconnecting flexible printed boards (1). To this end, electroconductive layers (2, 3) that are disposed on two opposite sides are conductively interconnected by piercing a hole into the printed board (1) with a simple burring tool (10), thereby producing a through-hole (4), and then injecting a defined amount of a conductive adhesive (5) into said through-hole (4) by means of a dosing needle (20). During piercing, the material of the printed board is stretched to such an extent that on the through-hole (4), on the side of the printed board (1), a funnel-shaped recess (7), and on the opposite side an elevated bulge (6) is produced. The conductive adhesive (5) filling the through-hole (4) is fed from the bulge side and wets the surface of the bulge (6) and the surface of the funnel-shaped recess (7).
申请公布号 WO0249403(A1) 申请公布日期 2002.06.20
申请号 WO2001EP14351 申请日期 2001.12.06
申请人 GIESECKE & DEVRIENT GMBH;ZAPF, RUDOLF;HOHMANN, ARNO 发明人 ZAPF, RUDOLF;HOHMANN, ARNO
分类号 H05K1/00;H05K3/00;H05K3/40 主分类号 H05K1/00
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