| 摘要 |
A semiconductor chip assembly includes a semiconductor chip and a molded substrate. The chip includes a conductive pad. The molded substrate includes a base, a bump that extends above the base, and a through-hole in the base that is offset from the bump and aligned with the pad. A routing line covers the bump and extends along a top surface of the molded substrate to the through-hole and extends through the through-hole and contacts the pad. The molded substrate is compressible and permits a portion of the routing line that covers the bump to exhibit elastic deformation in response to vertically oriented external pressure. A method of manufacturing the assembly includes forming the molded substrate and attaching the molded substrate to the chip by transfer molding, exposing the pad using the through-hole, depositing a metal layer on the molded substrate and in the through-hole and on the pad, and removing a portion of the metal layer to form the routing line.
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