Method of eliminating silicon residual from wafer after dicing saw process

摘要

Method of eliminating silicon residual from wafer after dicing saw process includes the steps of adhering a first adhesive tape or coating a cover layer on the surface of a wafer, transferring the adhered or coated wafer to a wafer dicing machine for forming dies, and removing the first adhesive tape or cover layer from the wafer. Silicon residual generated during dicing saw process will be deposited on the first adhesive tape or cover layer without depositing on the die surface. Removing the adhesive tape or cover layer will also remove the silicon residual. Thus wafer surface may be prevented from contamination of silicon residual and the consequent manufacturing processes and product quality won't be adversely affected.