发明名称 |
MULTI-LAYER CIRCUITS AND METHODS OF MANUFACTURE THEREOF |
摘要 |
A multi-layer circuit comprises a circuit (18) and a resin covered conductive layer (12) disposed on the circuit (18), wherein the resin covered conductive layer (12) comprises a liquid crystalline polymer resin (16) laminated to a conductive layer (14). Such multi-layer circuits are particularly useful for high density circuit applications. |
申请公布号 |
WO0249405(A2) |
申请公布日期 |
2002.06.20 |
申请号 |
WO2001US48948 |
申请日期 |
2001.12.13 |
申请人 |
WORLD PROPERTIES, INC. |
发明人 |
ST. LAWRENCE, MICHAEL, E.;KENNEDY, SCOTT, D. |
分类号 |
B32B15/08;H05K3/46 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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