Method for mounting an electronic component e.g. microchip on carrier e.g. printed circuit board, involves making simultaneous contact between component's contacts and those of the printed circuit board.

摘要

On the topside of a modular printed circuit board (PCB) (1) there are contacts/footprints (2) to make a conductive connection with corresponding contacts/underside footprints (3) for a ball grid array or chip size package component (4) waiting to be mounted by a conductive transition piece (CTP) (5) that uses adhesive connections to connect to the PCB and the component. The CTP is first glued as a mask to the PCB and to part of the contacts there. An Independent claim is also included for a carrier like a printed circuit board with an electronic component fitted on it and the component's contacts making conductive contact with contacts on the carrier.