发明名称 Plating bath analysis
摘要 Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.
申请公布号 US2002074244(A1) 申请公布日期 2002.06.20
申请号 US20010002039 申请日期 2001.11.02
申请人 SHIPLEY COMPANY, L.L.C. 发明人 SONNENBERG WADE;KAPECKAS MARK J.;JACQUES DAVID L.;CRUZ RAYMOND;BARSTAD LEON R.;NAJJAR ELIE H.;STEP EUGENE N.;BINSTEAD ROBERT A.
分类号 G01N27/48;C25D21/12;C25D21/14;G01N27/42;(IPC1-7):G01N27/48 主分类号 G01N27/48
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