发明名称 |
VARNISH FOR LAMINATE OR PREPREG, LAMINATE OR PREPREG OBTAINED WITH THIS VARNISH, AND PRINTED CIRCUIT BOARD MADE WITH THIS LAMINATE OR PREPREG |
摘要 |
<p>A varnish for laminates or prepregs, characterized by comprising (d) an inorganic filler and a composition obtained by mixing (a) an epoxy resin, (b) a dicyandiamide, and (c) a compound having an imidazole ring in such a proportion that the content of the ingredient (c) is 0.001 to 0.03 wt.% based on the ingredient (a) and reacting the mixture in an organic solvent at a temperature of 70 DEG C to 140 DEG C, excluding 140 DEG C, to heat-treat the mixture so that the two ingredients are compatibilized in the absence of a solvent; a flame-retardant laminate or prepreg for electrical insulation which is obtained with the varnish; and a printed circuit board.</p> |
申请公布号 |
WO0248236(A1) |
申请公布日期 |
2002.06.20 |
申请号 |
WO2001JP10884 |
申请日期 |
2001.12.12 |
申请人 |
HITACHI CHEMICAL CO., LTD.;HIRAI, YASUYUKI;ABE, NORIHIRO;TAKEDA, YOSHIYUKI |
发明人 |
HIRAI, YASUYUKI;ABE, NORIHIRO;TAKEDA, YOSHIYUKI |
分类号 |
B32B15/08;C08G59/40;C08G59/68;H05K1/03;(IPC1-7):C08G59/40;C08G59/50;C08J5/24;H05K3/46 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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