LEAD CUT DIE FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A lead cut die for semiconductor packages is provided to improve durability and workability by forming an inserting and fixing part in an integral holder of the lead cut die. CONSTITUTION: An inserting and fixing part(3) is formed on an inner surface of an integral holder(2). A plurality of dies(4) include a base(5) and a protrusion part on the lower portion of the base(5), respectively. At this time, the dies(4) are inserted and fixed to the integral holder(2). That is, the protrusion part of the die(4) is inserted and fixed to the inserting and fixing part(3) of the integral holder(2). Preferably, the inserting and fixing part(3) of the integral holder(2) is formed corresponding to quad-type according to the direction of a lead(L) of a semiconductor package. Preferably, the die(4) is selectively inserted and fixed to the inserting and fixing part(3) corresponding to quad-type or dual-type according to the direction of the lead(L) of the semiconductor package.