| 摘要 |
In one aspect, the invention includes a semiconductor processing method of diffusing dopant into both n-type and p-type doped regions of a semiconductive substrate. A semiconductive material is provided. The semiconductive material has a first portion and a second portion. The first portion is a p-type doped portion and the second portion is an n-type doped portion. A mask material is formed over the p-type and n-type doped portions. A first opening is formed to extend through the mask material and to the n-type doped portion. A second opening is formed to extend through the mask material and to the p-type doped portion. Conductively doped polysilicon is formed within the first and second openings. Dopant is out-diffused from the conductively-doped polysilicon and into the n-type and p-type doped portions. In another aspect, the invention includes methods of forming CMOS constructions. In yet another aspect, the invention encompasses methods of forming DRAM constructions.
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