| 摘要 |
A method and structure for interfacing a thermally conductive pad between a heat generating module and a heatsink, such that the pad is in substantial thermal contact with both the module and the heatsink despite the fact that both the module and the heatsink are under mechanical tension. The mechanical tension causes deflection of a surface of the module and a surface of the heatsink so as to generate an air gap between the pad and the heatsink, as well as between the pad and the module. The present invention overcomes the deflection by crowning the pad, crowning the heatsink, or crowning the module.
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