发明名称 |
Laser cutting apparatus and method |
摘要 |
A laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated. The pre-scriber can be a rotating blade.
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申请公布号 |
US6407360(B1) |
申请公布日期 |
2002.06.18 |
申请号 |
US19990231091 |
申请日期 |
1999.01.14 |
申请人 |
SAMSUNG ELECTRONICS, CO., LTD. |
发明人 |
CHOO DAE-HO;KIM BYEONG-ILL;JUNG SUNG-UK;LEE WOO-SHIK;KIM BUM-SOO |
分类号 |
B23K37/00;B23K26/00;B23K26/04;B23K26/06;B23K26/067;B23K26/14;B23K26/40;B23K26/42;B28D1/22;B28D5/00;C03B33/07;C03B33/09;G02F1/1333;H01L21/00;(IPC1-7):B23K26/38 |
主分类号 |
B23K37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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