发明名称 Laser cutting apparatus and method
摘要 A laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated. The pre-scriber can be a rotating blade.
申请公布号 US6407360(B1) 申请公布日期 2002.06.18
申请号 US19990231091 申请日期 1999.01.14
申请人 SAMSUNG ELECTRONICS, CO., LTD. 发明人 CHOO DAE-HO;KIM BYEONG-ILL;JUNG SUNG-UK;LEE WOO-SHIK;KIM BUM-SOO
分类号 B23K37/00;B23K26/00;B23K26/04;B23K26/06;B23K26/067;B23K26/14;B23K26/40;B23K26/42;B28D1/22;B28D5/00;C03B33/07;C03B33/09;G02F1/1333;H01L21/00;(IPC1-7):B23K26/38 主分类号 B23K37/00
代理机构 代理人
主权项
地址