| 发明名称 |
Method for producing an electrical connection between the front and rear sides of semiconductor chips |
| 摘要 |
A method for producing an electrical connection between front and rear sides of semiconductor chips in the wafer process.
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| 申请公布号 |
US6406937(B1) |
申请公布日期 |
2002.06.18 |
| 申请号 |
US20000658713 |
申请日期 |
2000.09.11 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HEDLER HARRY |
| 分类号 |
H01L21/60;H01L21/768;H01L23/485;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/60 |
| 代理机构 |
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