发明名称 |
COOLING SYSTEM FOR HEAT PIPE |
摘要 |
PURPOSE: A cooling system for a heat pipe is provided to enhance the cooling efficiency by emitting the heat of a CPU(Central Processing Unit) via a thin film louver fin attached to a portion of a module plate. CONSTITUTION: The system comprises a module plate(10) having a contact surface(13) in contact with the heat emitting surface of a CPU, a cooling fan(20) prepared at a condensing unit(11) of the module plate to enhance the cooling efficiency by generating an airflow, and a heat pipe(30) to enhance the heat conductivity between the contact surface and the condensing unit of the module plate. Many heat emitting fins are formed in the condensing unit. A forcible convection flow toward one face of the condensing unit is formed by the cooling fan. The heat pipe is made of a high thermal conductivity material. A blade(21) for blowing air around a rotor is formed integral to the cooling fan. The wind generated by the cooling fan is forcibly guided to the condensing unit.
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申请公布号 |
KR20020044370(A) |
申请公布日期 |
2002.06.15 |
申请号 |
KR20000073425 |
申请日期 |
2000.12.05 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
OH, SE MIN |
分类号 |
G06F1/20;(IPC1-7):G06F1/20 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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