发明名称 COOLING SYSTEM FOR HEAT PIPE
摘要 PURPOSE: A cooling system for a heat pipe is provided to enhance the cooling efficiency by emitting the heat of a CPU(Central Processing Unit) via a thin film louver fin attached to a portion of a module plate. CONSTITUTION: The system comprises a module plate(10) having a contact surface(13) in contact with the heat emitting surface of a CPU, a cooling fan(20) prepared at a condensing unit(11) of the module plate to enhance the cooling efficiency by generating an airflow, and a heat pipe(30) to enhance the heat conductivity between the contact surface and the condensing unit of the module plate. Many heat emitting fins are formed in the condensing unit. A forcible convection flow toward one face of the condensing unit is formed by the cooling fan. The heat pipe is made of a high thermal conductivity material. A blade(21) for blowing air around a rotor is formed integral to the cooling fan. The wind generated by the cooling fan is forcibly guided to the condensing unit.
申请公布号 KR20020044370(A) 申请公布日期 2002.06.15
申请号 KR20000073425 申请日期 2000.12.05
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 OH, SE MIN
分类号 G06F1/20;(IPC1-7):G06F1/20 主分类号 G06F1/20
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