发明名称 ELECTRONIC CIRCUIT BOARD, ELECTRONIC COMPONENT, ELECTRONIC CIRCUIT DEVICE AND MANUFACTURING METHOD OF THEM
摘要 PROBLEM TO BE SOLVED: To provide an electronic circuit board, an electronic component, an electronic circuit device and a manufacturing method of them, wherein repair of an electronic component like an LSI is facilitated and a connecting method of low cost which has high reliability and reduces time for connection is used. SOLUTION: In the electronic circuit board 5, having an electrode terminal 4 to be connected with an electronic component 1, the electrode terminal 4 has a metal protrusion 3, which is mainly composed of intermetallic compound. The intermetallic compound is a copper-tin based compound.
申请公布号 JP2002171055(A) 申请公布日期 2002.06.14
申请号 JP20000366842 申请日期 2000.12.01
申请人 HITACHI LTD 发明人 HARADA MASAHIDE;NAKANO ASAO;USHIFUSA NOBUYUKI;YODA TOMOKO;YAMASHITA SHIRO
分类号 B23K1/00;H01L21/60;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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