| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for a relatively thick heat sink for mounting a circuit chip integrally with a thin lead in a lead frame for a semiconductor device. SOLUTION: A metal strip material 11 having a plurality of protrusions 11c is used. The protrusions 11c are extended in the direction of the continuous length of the strip material 11 with a mutual interval in the direction of the short length of the strip material 11 each other. The metal strip material 11 is punched, thus forming a plurality of heat sinks 2, a heat sink connection section 4, a plurality of leads 3, and a lead connection section 5 to obtain a lead frame 1. The plurality of heat sinks 2 is arranged continuously in the direction of the continuous length on the protrusions 11. The leads 3 are arranged by bringing inner ends closer to both the sides in the direction of the short length of each of the heat sinks 2 for extending in the direction of short length. The lead connection section 5 is arranged so that it connects the outer ends of the leads 3, thus integrating the relatively thick heat sinks 2 and the relatively thin leads 3 on the strip material 11, and hence abbreviating the process for connecting the leads separate from the heat sinks using an adhesive or the like later.
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