| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of a package board and a flip chip device, which can eliminate high frequency operation failures of a MCM by taking a simple means and facilitate a test of a flip chip device as well as an exchange of a failure device easily. SOLUTION: A package board 1 comprises electrodes 2 respectively corresponding to bumps 5A formed on a flip chip device 5, sustaining posts 3 formed to keep a clearance constant and parallel between the package board 1 and the flip chip device 5, and vacuum suction inlet 4 connected to a vacuum evacuation means to fix the flip chip device 5 tentatively by vacuum suction.
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