发明名称 SOI SUBSTRATE, MANUFACTURING METHOD THEREOF, ELEMENT SUBSTRATE, MANUFACTURING METHOD THEREOF, ELECTROOPTICAL DEVICE, ELECTRONIC APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide an SOI substrate and its manufacturing method which perfectly prevents impurities contained in a support substrate or adsorbed to a cladding surface of the substrate support with a single crystal silicon substrate from diffusing to a single crystal silicon layer. SOLUTION: The SOI substrate 200 is manufactured by steps of thermally oxidating a single crystal silicon substrate 202A surface to form a first silicon oxide film 203B, nitriding or oxynitriding the single crystal silicon substrate 202A surface to form a silicon nitride film or a silicon oxynitride film 204, thermally oxidating the single crystal silicon substrate 202A surface to form a second silicon oxide film 203A, cladding the support substrate 201 with the single crystal silicon substrate 202A through a cladding surface using the first silicon oxide film 203B surface, and finally thinning the single crystal silicon substrate 202A clad to the support substrate 201 to form a single crystal silicon layer 202.</p>
申请公布号 JP2002170942(A) 申请公布日期 2002.06.14
申请号 JP20000365714 申请日期 2000.11.30
申请人 SEIKO EPSON CORP 发明人 YASUKAWA MASAHIRO
分类号 G02F1/136;G02F1/1368;H01L21/02;H01L21/336;H01L27/12;H01L29/786;(IPC1-7):H01L27/12 主分类号 G02F1/136
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