发明名称 |
SOI SUBSTRATE, MANUFACTURING METHOD THEREOF, ELEMENT SUBSTRATE, MANUFACTURING METHOD THEREOF, ELECTROOPTICAL DEVICE, ELECTRONIC APPARATUS |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an SOI substrate and its manufacturing method which perfectly prevents impurities contained in a support substrate or adsorbed to a cladding surface of the substrate support with a single crystal silicon substrate from diffusing to a single crystal silicon layer. SOLUTION: The SOI substrate 200 is manufactured by steps of thermally oxidating a single crystal silicon substrate 202A surface to form a first silicon oxide film 203B, nitriding or oxynitriding the single crystal silicon substrate 202A surface to form a silicon nitride film or a silicon oxynitride film 204, thermally oxidating the single crystal silicon substrate 202A surface to form a second silicon oxide film 203A, cladding the support substrate 201 with the single crystal silicon substrate 202A through a cladding surface using the first silicon oxide film 203B surface, and finally thinning the single crystal silicon substrate 202A clad to the support substrate 201 to form a single crystal silicon layer 202.</p> |
申请公布号 |
JP2002170942(A) |
申请公布日期 |
2002.06.14 |
申请号 |
JP20000365714 |
申请日期 |
2000.11.30 |
申请人 |
SEIKO EPSON CORP |
发明人 |
YASUKAWA MASAHIRO |
分类号 |
G02F1/136;G02F1/1368;H01L21/02;H01L21/336;H01L27/12;H01L29/786;(IPC1-7):H01L27/12 |
主分类号 |
G02F1/136 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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