| 摘要 |
PROBLEM TO BE SOLVED: To achieve a device that can transfer a film onto a substrate, where the film cannot be easily formed directly, even in a process requiring high temperature. SOLUTION: In this transfer method, films 15 to 17 to be transferred formed on first substrates 11 and 12 are transferred onto second substrates 18 and 19. Also, the transfer method includes a first process for successively forming a peeling layer 13 and the film to be transferred on the first substrate; a second process for bonding the second substrate having a different thermal coefficient of expansion from the film to be transferred and the first substrate to the film to be transferred; and a third process for heating or cooling the bonded first and second substrates for generating peeling in the peeling layer, and for transferring the film to be transferred onto the second substrate. |
