发明名称 NONCONTACT TEMPERATURE MEASURING APPARATUS AND METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a noncontact temperature measuring apparatus of a simple constitution which can measure the temperature of an object, e.g. a semiconductor wafer or the temperature distribution thereof conveniently with high accuracy. SOLUTION: An electronic circuit is formed by integration, and a plurality of spherical semiconductors mounting a coil on the surface are fixed to an object being measured. The electronic circuit comprises a power supply section generating an internal power supply from electromagnetic energy received via the coil, a temperature-sensitive element section sensitive to the temperature of the object, a sensing circuit for detecting the output from the temperature- sensitive element section, a section for transmitting the output from the sensing circuit via the coil, and a memory for storing an ID number inherent to the spherical semiconductor. A data collector comprises an energy source for supplying electromagnetic energy to the coil of the spherical semiconductor, a transmission section for designating a spherical semiconductor using the ID number, and a receiving section for detecting information transmitted from the coil.
申请公布号 JP2002168699(A) 申请公布日期 2002.06.14
申请号 JP20000367070 申请日期 2000.12.01
申请人 YAMATAKE CORP 发明人 KANO SHIRO
分类号 G01K1/02;G01K7/00;G06K19/00;H01L21/66 主分类号 G01K1/02
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