| 发明名称 |
Chemical mechanical polishing method for slurry free fixed abrasive pads |
| 摘要 |
A fixed abrasive chemical polishing method uses an aqueous solution that has a variable pH. During polishing the pH of the aqueous solution is changed so that the polishing process can be more precisely controlled. The removal rate and removal selectivity between oxide and nitride can be controlled by varying the pH of the aqueous solution.
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| 申请公布号 |
US2002072238(A1) |
申请公布日期 |
2002.06.13 |
| 申请号 |
US20000737123 |
申请日期 |
2000.12.13 |
| 申请人 |
PENG CHENG-AN;WANG JIUN-FANG |
发明人 |
PENG CHENG-AN;WANG JIUN-FANG |
| 分类号 |
B24B1/00;B24B7/22;B24B37/04;B24B51/00;H01L21/302;H01L21/3105;H01L21/461;(IPC1-7):H01L21/302 |
主分类号 |
B24B1/00 |
| 代理机构 |
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