发明名称 INTEGRATED CIRCUIT WITH REDUCED SUBSTRATE COUPLING
摘要 <p>The invention concerns a substrate SB incorporating several electronic components C1, C2, and a seal ring SR enclosing the electronic components. It comprises means forming a cold spot VM, PG, BDG arranged between the electronic components and the seal ring. It further includes protection means against electrostatic discharges comprising an electrostatic discharge strip VM enclosing the electronic components and forming said cold spot means.</p>
申请公布号 WO2002047164(A2) 申请公布日期 2002.06.13
申请号 FR2001003721 申请日期 2001.11.26
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