发明名称 |
Enveloped thermal interface with metal matrix components |
摘要 |
An enveloped thermal interface servers as a heat-conducting spacer between a heat dissipating member and an electronic package or device. Embodiments of the present invention include a member comprising a hermetically sealed thermal interface. A conformable metallic envelope containing a heat-conducting matrix, such as a eutectic alloy having a melting point below the normal operating temperature of the packaged device.
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申请公布号 |
US2002070445(A1) |
申请公布日期 |
2002.06.13 |
申请号 |
US20000734552 |
申请日期 |
2000.12.13 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
TARTER THOMAS S. |
分类号 |
H01L23/427;H01L23/433;(IPC1-7):H01L23/42 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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