摘要 |
A circuit board, comprising a land (2) having a through hole (4) for inserting the lead (3) of an electronic part therein, wherein a lead (3) and the land (2) are mounted on the circuit board with lead-free solder (6), a solder resist (5) for protecting the circuit board (1) is formed so as to cover at least a part of a land outer peripheral end part (2a), i.e., at least the area of the land outer peripheral part (2a) liable to be subjected to the heat contraction of the solder to suppress the separation of the land and to cover the land outer peripheral end part on the side connected to a circuit formed in the circuit board and/or the end part on the side opposite to the end part on the side connected to the circuit.
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申请人 |
NEC CORPORATION;ISHIZUKA, NAOMI;MATSUMOTO, AKIHITO;KONO, EIICHI;SUZUKI, MOTOJI;SATO, AKIHIRO;MATSUOKA, HIROSHI;KANAI, MASAFUMI |
发明人 |
ISHIZUKA, NAOMI;MATSUMOTO, AKIHITO;KONO, EIICHI;SUZUKI, MOTOJI;SATO, AKIHIRO;MATSUOKA, HIROSHI;KANAI, MASAFUMI |