Method for manufacturing a semiconductor device

摘要

The invention provides a method for manufacturing a semiconductor device for preventing the low bonding strength reliability in flip tip mounting of a semiconductor chip on an organic substrate. In the thermal hardening process for hardening the under fill resin filled between a semiconductor chip and organic substrate. The thermal expansion due to rapid heating of an organic substrate is mitigated by applying multi-step heating process in which under fill resin is heated at a temperature T1 lower than the hardening temperature T2 of the under fill resin for a predetermined time.