发明名称 METHOD FOR ADJUSTING RAPID THERMAL PROCESSING (RTP) RECIPE SETPOINTS BASED ON WAFER ELECTRICAL TEST (WET) PARAMETERS
摘要 <p>A method is provided, the method comprising measuring at least one parameter characteristic of processing performed on a workpiece (100) in a processing step, and modeling the at least one characteristic parameter measured using a correlation model. The method also comprises applying the correlation model to modify the processing performed in the processing step.</p>
申请公布号 WO2002047150(A2) 申请公布日期 2002.06.13
申请号 US2001044112 申请日期 2001.11.06
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