发明名称 |
Plating catalysts and electronic packaging substrates plated therewith |
摘要 |
Disclosed are new catalysts for electroless metallization deposition, particularly catalysts that can be selectively activated and may be free of palladium and/or tin. Catalysts of the invention are preferably employed for electroless copper deposition.
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申请公布号 |
US2002069788(A1) |
申请公布日期 |
2002.06.13 |
申请号 |
US20010000865 |
申请日期 |
2001.10.24 |
申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
GOOSEY MARTIN T.;BAINS NARINDER SINGH |
分类号 |
C23C18/16;C23C18/28;(IPC1-7):C23C18/52;B05D3/10;B05D1/36 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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