发明名称 RESIN SEALING MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a resin sealing molding apparatus which resin-seals an optional surface of a product to form an exterior body. SOLUTION: A semi-finished article 50 produced by assembling a plurality of components integrally is housed in a pack case 7 with its bottom surface opened, the case 7 is arranged in the cavity 62a of a cavity 62, a mold is closed, a resin injection nozzle 65 is advanced, a core 63 is pushes to the cavity 62 against the bias of a spring 64, a resin is packed in a filling space 63a, and the open bottom surface of the pack case 7 is resin-sealed.
申请公布号 JP2002166447(A) 申请公布日期 2002.06.11
申请号 JP20000363518 申请日期 2000.11.29
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 IWAZONO YOSHINORI;KONISHI SHOJI
分类号 B29C45/26;B29C45/14;B29L31/34;H01M2/10;(IPC1-7):B29C45/26 主分类号 B29C45/26
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