发明名称 THERMAL HEAD
摘要 PROBLEM TO BE SOLVED: To provide a thermal head having a simple structure and exhibiting excellent productivity in which temperature of a heat sink can be detected accurately. SOLUTION: A head substrate 1 having a plurality of heating elements 2 and a plurality of conductive layers 3 and a reinforcing plate 4 made of resin are placed on a heat sink 9 while spaced apart by a specified interval and a flexible wiring board 5 having a plurality of wiring conductors 6 connected electrically with the conductive layers 3 are mounted on the reinforcing plate 4 in the thermal head. Upper surface of the heat sink 9 located between the heating element 2 and the reinforcing plate 4 is projected to the flexible wiring board 5 side and the protrusion 9a is abutted against the lower surface of the flexible wring board 5. A thermistor 7 is fixed onto the flexible wiring board 5 arranged at the abutting part.
申请公布号 JP2002166583(A) 申请公布日期 2002.06.11
申请号 JP20000363781 申请日期 2000.11.29
申请人 KYOCERA CORP 发明人 TERADA KENJI;KAJIO KOICHI
分类号 B41J2/335;(IPC1-7):B41J2/335 主分类号 B41J2/335
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