| 摘要 |
A method of manufacturing a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, and providing a support circuit that includes an insulative base and a conductive trace. One embodiment includes mechanically attaching the chip to the support circuit using an adhesive such that a portion of the pad is directly beneath the conductive trace, and then applying an etch to form openings in the base and the adhesive such that the opening in the base exposes the conductive trace and the openings expose the pad. Another embodiment includes disposing an adhesive beneath the support circuit, applying an etch to form openings in the base and the adhesive, and then mechanically attaching the chip to the support circuit using the adhesive such that the opening in the base exposes the conductive trace and the openings expose the pad. Preferably, a connection joint is formed inside the openings that contacts and electrically connects the conductive trace and the pad.
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