发明名称 Negative photosensitive resin composition, negative photosensitive dry film and method of forming pattern
摘要 The present invention provides a negative photosensitive resin composition comprising (A) a photocurable resin having a photosensitive group or groups crosslinkable by light irradiation, (B) a photoacid generator and (C) a photosensitizer which is a benzopyran condensed ring compound capable of increasing photosensitivity to visible light with a wavelength of 480 nm or more, a negative photosensitive dry film prepared by applying the photosensitive resin composition to a surface of support film, followed by drying, to form a photosensitive resin layer, and a method of forming a pattern using the resin composition or the dry film.
申请公布号 US2002068237(A1) 申请公布日期 2002.06.06
申请号 US20010976279 申请日期 2001.10.15
申请人 IMAI GENJI 发明人 IMAI GENJI
分类号 C08F2/50;C08K5/00;C08K5/3447;C08K5/42;C08L101/02;G03F7/004;G03F7/038;G03F7/34;(IPC1-7):G03F7/038;G03F7/38;G03F7/42 主分类号 C08F2/50
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