| 发明名称 |
Seed layer deposition |
| 摘要 |
Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.
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| 申请公布号 |
US2002066671(A1) |
申请公布日期 |
2002.06.06 |
| 申请号 |
US20010978797 |
申请日期 |
2001.10.17 |
| 申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
SHELNUT JAMES G.;MERRICKS DAVID;DUTKEWYCH OLEH B.;SHIPLEY CHARLES R. |
| 分类号 |
C23C18/16;H01L21/288;H01L21/768;H05K3/18;H05K3/38;H05K3/42;(IPC1-7):C25D5/00;C25D7/00;C25D7/12 |
主分类号 |
C23C18/16 |
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